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DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Dimensions of 0

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Dimensions of 0The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm) Thickness: 0. 020in (0. 5mm) Arbor: 0. 5in (12. 7mm) Item No DS 1005 1 pkg

SKU: 94936216978 · From chapuisstores.ch

4.7
USD155.00 USD194.00

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Description

Dimensions of 0

Item No: EFR-2008

Item No CBM-2005

Applications: Sintered Carbides

DiaSec Diamond Wafering Blade - General Purpose Metallography 5in 3 micron Dimensions of 0The DiaSec General Purpose Diamond Blade is a great choice for metallurgical sample sectioning. Made with metal bonding, this 5in blade can effortlessly cut through steel, stainless steel, copper, aluminum, Ni alloys, and titanium. Its versatility and precision make it an essential tool for any industry expert. Diameter: 5in (125mm) Thickness: 0. 020in (0. 5mm) Arbor: 0. 5in (12. 7mm) Item No DS 1005 1 pkg

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